Huawei Technologies Co., Ltd. – The Huawei Innovation Research Program (HIRP)- Call for Proposals

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Sponsor

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Description

The Huawei Innovation Research Program (HIRP) provides funding opportunities to leading universities and research institutes conducting innovative research in communication technology, computer science, engineering, and related fields. HIRP seeks to identify and support world-class, full-time faculty members pursuing innovation of mutual interest. Outstanding HIRP winners may be invited to establish further long-term research collaboration with Huawei.

Our ongoing programs regularly solicit proposals for funding, either through an open submission process (HIRP OPEN) or by invitation (HIRP FLAGSHIP).Let Huawei help bring your innovative ideas into practice. HIRP enables you by providing:

  • Information regarding research needs and challenging problems from the frontier of the information and communications industry
  • Financial support for your research ideas
  • Opportunities to be a long-term research partner with the Huawei Global Advanced R&D Team

HIRP OPEN:

HIRP OPEN is a 1-2 year award to support contract-based innovation research of world-class full-time faculty members at top universities around the world.

Through a formal review process by Huawei Technical Experts Group members and invited international distinguished scholars, selected proposals will receive financial support with the amount ranging from USD 30,000 to USD 70,000. In some cases, larger awards may be possible for especially outstanding proposals.

Please note that joint research proposals from multiple universities will not be accepted in the HIRP Open program, but can be considered for the HIRP FLAGSHIP program.

Conducting innovative research in:

  • Advanced Semiconductor Technology
  • BigData & Artificial Intelligence
  • BlockChain
  • Cloud Networking
  • Compiler & Programming Language
  • Computing Technology
  • Data Management and Process
  • Engineering Technology
  • Future Networks
  • Human-Computer Interaction
  • IoT
  • Materials
  • Media Technology
  • Network & Information security Technology
  • Operation System
  • Optical Technology
  • Software Engineering
  • Storage Technology
  • Wireless Communication Technology
  • Power Supply Technology

Note:
1. The first phase of 2018 HIRP OPEN has been launched on April, 15th,and other phases will be gradually launched in the next two weeks of April. Thank you for your attention and welcome to submit your IDEA.
2. After the deadline of proposal submission, any form of proposal submission will not be accepted, thank you for your understanding.

Proposal Link: http://innovationresearch.huawei.com/IPD/hirp/portal/hirp/hirpOpenSearchList.html

Contact Information

Hema Prabhu
Contracts Assistant
innovations.partnerships@utoronto.ca | (416) 978-5557

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